Plate pack, a plate heat exchanger, and a plate module
US7424908B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 2, 2004 |
| Grant date | Sep 16, 2008 |
| Priority date | — |
| Expiry date | Nov 9, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/364
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention relates to a plate package and a plate heat exchanger. The plate package includes plate modules with two heat exchanger plates (3), which extend at at least an intermediate plane, and upper and lower planes. The heat exchanger plates are permanently connected to each other and form an inner first space therebetween. The plate modules are stacked to each other and form a second space therebetween. Each heat exchanger plate includes two portholes (13) which permit communication with the first space. Each porthole is defined by a port edge (31) and surrounded by a ring groove (32) for a gasket member. The ring groove is formed by a bottom (33) at the level of the intermediate plane, an inner lateral limitation (34) and an outer lateral limitation (35). The outer lateral limitation forms a surface extending without any interruptions. The inner lateral limitation includes interruptions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.