Thermography test method and apparatus for bonding evaluation in sputtering targets
US7425093B2 · kind B2 · utility
15Cited by
35References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2004 |
| Grant date | Sep 16, 2008 |
| Priority date | — |
| Expiry date | Mar 21, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30152
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.