Light emitting diode package
US7425731B2 · kind B2 · utility
0Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2007 |
| Grant date | Sep 16, 2008 |
| Priority date | — |
| Expiry date | Mar 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
Abstract
A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.