Sensor module
US7426868B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2004 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Nov 17, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor module having a sensor housing which includes a housing part in which electrical conductors are partially embedded, the sensor housing being provided with a first cavity, in which a sensor system is situated, and a second cavity which is sealed against the first cavity and in which is provided at least one capacitor, and the first cavity being provided with a receptacle part having a receptacle formed by a peripheral wall, the sensor system being inserted into this receptacle and covered by a protective covering filled into the receptacle. The sensor system is contacted with connecting elements provided on the receptacle part, these connecting elements being directly connected to connecting sections of the electrical conductors; and the at least one capacitor provided in the second cavity is connected to at least one of the electrical conductors via an electrically conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.