Paper handling system materials exit path arrangement
US7427059B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2005 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Sep 16, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65H5/26
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A materials handling system includes an insertion subsystem for inserting materials into envelopes to form mailpieces of a first type and mailpieces of a second type. The materials handling syatem also includes a first mailpiece transport path located downstream from the insertion subsystem and having a curved portion along which mailpieces of said first type are transported, and a second mailpiece transport path being substantially horizontal, located downstream from the insertion subsystem, and along which mailpieces of the second type are transported. Further, a diverter is included that diverts mailpieces of the first type to the first transport path and mailpieces of the second type to the second transport path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.