Single loading mechanism to apply force to both cooling apparatus and integrated circuit package
US7427210B2 · kind B2 · utility
2Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2006 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Jul 4, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.