Methods for coupling diamond structures to photonic devices
US7427525B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2006 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Oct 26, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2202/32
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a method for coupling a photonic device with a diamond structure comprises embedding the diamond structure in a first substrate, where the first substrate comprises a first transparent material. The photonic device is formed in a semiconductor material, which is supported by a second substrate. An intermediate structure is formed by depositing a second transparent material over the photonic device. The second transparent material may have substantially the same refractive index as the first transparent material. The intermediate structure is then separated from the second substrate, and the intermediated structure is adhered to the first substrate so that the photonic device optically couples with the diamond structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.