Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler
US7427652B2 · kind B2 · utility
2Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2003 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Nov 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared to a composition not containing the filler, an optional polybenzoxazine resin, and an optional co-curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.