Piezoelectric device and method for producing same
US7427824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2007 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Jul 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A piezoelectric device ensures resistance to molding without an increase in costs and includes an elemental substrate having a piezoelectric element and a conductive pattern electrically connected to the piezoelectric element; and insulating members disposed on the elemental substrate and surrounding the piezoelectric element leaving a space around the piezoelectric element. The insulating members have an internal conductor connected to the conductive pattern and extending apart from the elemental substrate. The internal conductor has expanded portions expanding in a direction intersecting the wiring direction of the internal conductor or a detour portion deviating from the wiring direction. The expanded portions or the detour portion crosses the boundary of a sealed space formed around the piezoelectric element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.