Patent · US Active

Cooling arrangement

US7428151B2 · kind B2 · utility

27Cited by

14References

14Claims

0Family size

Assignee

RITTAL RES Electronic Systems GmbH & Co. KG · DE

Inventors

Werner Sonnabend · Neuenbürg, DE
Mouhamadou Ousmane · Marburg, DE
Wilfried Braun · Mainz, DE
Kurt-Michael Schaffer · Seckau, AT

Key dates

Filing date	Oct 28, 2005
Grant date	Sep 23, 2008
Priority date	—
Expiry date	Nov 15, 2026

Classification

Technology area (CPC G)Physics
CPC primaryG06F2200/201
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, to be cooled, on the respective printed circuit board or the plug-in module. The feed line is coupled with at least one component feed line assigned to the electronic component. The return-flow line is coupled with at least one component return-flow line assigned to the electronic component. The printed circuit board or the plug-in module has an area for fitting electronic components and a coupling area for coupling the feed line with the component feed line and for coupling the return-flow line with the component return-flow line.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.