Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board
US7428154B2 · kind B2 · utility
23Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2003 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Nov 3, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.