Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process
US7428979B2 · kind B2 · utility
3Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2004 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Jul 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/111
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.