Successive vapour deposition system, vapour deposition system, and vapour deposition process
US7429300B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 22, 2002 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | May 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/631
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A successive vapor deposition system in which a vapor deposition material is heated, vaporized in a vacuum, and deposited onto a vapor deposition area of a substrate, includes a conveyer which conveys the substrate in a conveying direction parallel to a plane on which the substrate lies, wherein the vapor deposition area faces downward and is exposed through the underside of the conveyer; a plurality of vapor deposition chambers aligned in the conveying direction, each the vapor deposition chamber including a space through which the substrate is conveyed; at least one container positioned in each of the plurality of vapor deposition chambers below the plane on which the substrate lies, and containing the vapor deposition material, wherein a width of the container covers the vapor deposition area in a direction perpendicular to the conveying direction; and a heating medium provided for the container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.