Method of manufacturing an article comprising at least one electronic chip
US7429308B2 · kind B2 · utility
0Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2002 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Feb 2, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG07D7/01
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step:Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.