Method for forming ceramic microstructures on a substrate using a mold
US7429345B2 · kind B2 · utility
1Cited by
64References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2005 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Dec 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2211/36
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A microstructured assembly including a barrier portions and land portions is described. The microstructures have alternating barrier portions and land portions that have barrier surfaces and land surfaces, respectively. Each barrier surface and land surface is connected by curved surface, which is part of a curved portion. The curved surface and the land surface are substantially continuous.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.