Method of using ultrasonics to plate silver
US7429400B2 · kind B2 · utility
0Cited by
15References
6Claims
0Family size
Inventors
Key dates
| Filing date | Dec 14, 2005 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Feb 2, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/073
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of reducing solder mask interface attack in a process of fabricating printed circuit boards. The method comprises the steps of providing a printed circuit board with a solder mask applied thereon and treating the printed circuit board with an immersion plating solution, wherein the immersion plating solution is plated onto the printed circuit board with the use of ultrasonics in the plating bath. It has been found that the use of ultrasonics at a frequency of about 40 kHz for the entire plating duration provides beneficial results.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.