Superconformal metal deposition using derivatized substrates

US7429401B2 · kind B2 · utility

Assignee

• The United States of America, as Represented by the Secretary of Commerce National Institute of Standards and Technology · US

Inventors

• Daniel Josell · Gaithersburg, US
• Thomas P. Moffat · Gaithersburg, US
• Daniel Wheeler · Travilah, US

Key dates

• Filing date: May 23, 2003
• Grant date: Sep 30, 2008
• Expiry date: Jul 4, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/423
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal process produces a seam-free and void-free metal microelectronic conductor.