Battery pack having circuit substrate resin molded to battery
US7429432B2 · kind B2 · utility
7Cited by
17References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2003 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Oct 11, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4911
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A rechargeable battery (2) and a circuit substrate (3) are connected by lead plates (4, 5) and united by a primary mold (11) that is formed by filling resin therebetween, after which a secondary mold (12) is formed on the outer face by filling resin at necessary locations and a winding sheet (13) is wound around the periphery, thereby forming a battery pack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.