Optoelectronic component and method for producing it

US7429758B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Marcus Ruhnau · Furth im Wald, DE
• Bert Braune · Völklingen, DE
• Patrick Kromotis · Regensburg, DE
• Georg Bogner · Lappersdorf, DE

Key dates

• Filing date: May 31, 2005
• Grant date: Sep 30, 2008
• Expiry date: Feb 8, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48247

Abstract

An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.