Method and device for analyzing the surface of a substrate
US7430049B2 · kind B2 · utility
11Cited by
14References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2001 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Aug 9, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/956
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process for scanning a surface of a substrate, which process takes at least one reflected image of at least one test pattern on the surface and extracts by digital processing local phases in two directions. Variations in local slopes are calculated by digital processing from the local phases to deduce therefrom variations in curvature or variations in altitude of the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.