Electronic circuit board
US7430127B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 18, 2005 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Nov 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4614
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic circuit board having an optical wiring layer sandwiched between two electrical wiring layers. The optical wiring layer is structured to be a two-dimensional optical waveguide. An E/O device and an O/E device are provided in the optical wiring layer or at an interface between the optical wiring layer and the electrical wiring layer. A via piercing the optical wiring layer connects the two electrical wiring layers. It is possible to efficiently input and output light to and from an optical wiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.