Etchant, replenishment solution and method for producing copper wiring using the same
US7431861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2004 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | Mar 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen atoms only as heteroatoms residing in a ring. A method for producing a wiring by etching of copper or copper alloys, includes the step of: etching a portion of a copper layer on an electrical insulative member that is not covered with an etching resist using the above-described etchant so as to form the wiring. Thereby, a fine and dense wiring pattern with reduced undercut can be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.