Resin composition for encapsulating semiconductor chip and semiconductor device therewith
US7431990B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 25, 2005 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | Sep 8, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack resistance during soldering and flame retardance. Specifically, this invention provides a resin composition for encapsulating a semiconductor chip comprises an epoxy resin (A) containing the specific structure; a phenolic resin (B) containing the specific structure; an inorganic filler (C); a curing accelerator (D); a silane coupling agent (E); and Compound (F) containing an aromatic ring in which at least two adjacent carbon atoms of the ring member carbon atoms are coupled to a hydroxyl group, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.