Silicone-modified single-component casting compound
US7432334B2 · kind B2 · utility
0Cited by
13References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | May 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A casting compound based on a resin which cures by a chemical reaction. The casting compound is suitable for insulation of electric components and contains an epoxy resin component, a silicone-containing component, a filler, and a thermal initiator. This casting compound is processible as a single-component system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.