Assembly of modularized housing and door cover
US7432441B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 14, 2006 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | Nov 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1411
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly of modularized housing and door cover includes a modularized housing; a door cover having a upper part thereof formed with at least one sleeve for putting around the axial pin, and a main body thereof formed with a plurality of ventilation openings; a film having a surface thereof partially adhered to peripheral areas of the ventilation openings using an adhesive layer to form loose-leaf connection; and spring accommodated in the axial pin, and having one end thereof pushed against the wall surface and the other end thereof pushed against an inner wall of the door cover. The modularized housing is provided with excellent ventilation effects therein when assembled with power supply device. The accommodating chambers are not assembled with power supply devices, external air in large amounts is prevented from entering into the idle accommodating chamber, thereby forming negative pressure at the interior of the modularized housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.