Heat spreader module
US7433187B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2004 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | Apr 4, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 μm when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 μg/cm2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.