Electronic module and method for sealing an electronic module
US7433197B2 · kind B2 · utility
7Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 28, 2006 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | Aug 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09063
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for sealing electronic module conductors is provided. Electronic modules typically consist of an electronic circuit board (“PCB”) with electronic components, an integral housing/connector assembly, conductors such as wires or terminal pins, and a mounting feature. A method for sealing electronic module conductors is provided which improves the sealing properties around the conductors positioned on the first and second side of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.