Method of manufacturing a microphone
US7434305B2 · kind B2 · utility
95Cited by
53References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 2004 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Dec 25, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.