Hermetic attachment method for pressure sensors
US7434474B1 · kind B1 · utility
11Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 2007 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Jul 13, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/147
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor includes a sensor die coupled to a glass support tube and located within a metallic intermediate sleeve. The glass support tube is bonded or otherwise attached to the metallic intermediate sleeve with solder or other adhesive material. End portions of the glass support tube and the metallic intermediate sleeve are configured to have complementary, contoured surfaces such that at least a portion of an attachment layer located there between is placed in compression during operation of the pressure sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.