Surface-mountable radiation-emitting component
US7436002B2 · kind B2 · utility
34Cited by
22References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2003 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Dec 29, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.