Patent · US Active

Micromechanical component having an anodically bonded cap and a manufacturing method

US7436076B2 · kind B2 · utility

1Cited by

6References

2Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Heiko Stahl · Reutlingen, DE
Nicolaus Ulbrich · Gomaringen, DE
Rainer Straub · Entringen, DE

Key dates

Filing date	Aug 29, 2006
Grant date	Oct 14, 2008
Priority date	—
Expiry date	Oct 1, 2026

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0109
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the functional wafer. the cap wafer is joined at the glass substrate to the functional wafer by anodic bonding. the electrical contact surface is disposed on a side of the functional wafer facing the cap wafer, and the cap wafer has at least one recess, such that an access is provided to the electrical contact surface. A method for encapsulating a micromechanical component having a cap wafer, by anodically bonding the cap wafer to a functional wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.