Heat sinks for electronic enclosures
US7436660B2 · kind B2 · utility
19Cited by
17References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2006 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Feb 15, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY04S40/00
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
An apparatus for cooling electronics is disclosed. The apparatus generally relates to heat sinks that are operatively connected to electronics enclosures. The heat sinks may be part of the electronics enclosure, or alternately they may be operatively connected to the electronics enclosure. An enclosure preferably prevents solar radiation from striking the surface of the heat sink. At the same time, the enclosure allows air to flow over the heat sink, allowing heat to be dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.