Heat-dissipating assembly of computer housing
US7436665B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2007 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Jun 26, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat-dissipating assembly of a computer housing with airways includes a casing. The casing is provided with a first partition and a second partition thereon. The first partition has a recessed space. The first partition is provided thereon with a plurality of penetrating troughs. The second partition is provided with a plurality of air-introducing ports thereon. The positions of the air-introducing ports and the positions of the penetrating troughs of the first partition are staggered respectively. Finally, the back and top of the casing are provided at least one fan respectively. Via this arrangement, after the external air enters the recessed space through the plurality of air-introducing ports, the external air is drawn into the casing by the fan on the first partition to perform an air-cooling effect and the heat dissipation. Finally, the air is drawn out of the casing by the fans provided on the top and back of the casing. Therefore, not only a good heat-dissipating effect can be achieved, but also the noise is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.