Connector for testing a semiconductor package
US7438563B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 5, 2005 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Dec 5, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2863
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.