Adjustable shielding plate for adjusting an etching area of a semiconductor wafer and related apparatus and methods
US7438765B2 · kind B2 · utility
9Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2005 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Apr 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for adjusting an etching area of a semiconductor wafer includes an adjustable shielding plate. The adjustable shielding plate includes a plurality of shielding members. Each of the plurality of shielding members are movable between a first position configured to shield a portion of a semiconductor wafer from an etching gas and a second position configured to expose an unshielded etching portion of the semiconductor wafer to the etching gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.