Semiconductor device encapsulation
US7439096B2 · kind B2 · utility
13Cited by
19References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2001 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Jun 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/615
Abstract
An encapsulated semiconductor device and method wherein an encapsulant material is deposited on the device in an environment that enhances device performance. Illustrative encapsulant materials are organic polymers, silicon polymers and metal/polymer-layered encapsulants. Encapsulant formation environments may include inert, reducing and ammonia gas environment. Further disclosed are an encapsulated transistor and a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.