Hot-melt adhesive

US7439305B2 · kind B2 · utility

Assignee

• Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

• Gunter Hoffmann · Hofheim, DE
• Ralf Grauel · Hilden, DE
• Richard Scholta
• Thomas Moeller · Goldkronach, DE
• Ralf Eberhardt · Aalen, DE

Key dates

• Filing date: Jun 18, 2007
• Grant date: Oct 21, 2008
• Expiry date: Jun 18, 2027

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2666/02
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.