Multi-chip module packaging with thermal expansion coefficiencies
US7439452B2 · kind B2 · utility
4Cited by
17References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 13, 2003 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Aug 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10924
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member are placed in the center of the transfer-mold structure to make thermal stresses symmetrical and thus suppress strains.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.