Module assembly for multiple die back-illuminated diode
US7439516B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2004 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Jun 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/1898
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A computerized tomography imaging scanner module includes a plurality of scintillators, a plurality of back-illuminated photodiodes optically coupled with the scintillators, a multi-layer substrate having a plurality of substrate electrical conductors to which the photodiodes are electrically coupled, wherein each of the plurality of substrate conductors is connected to a different one of the back-illuminated photodiodes, and a flexible cable having a plurality of flex electrical conductors to which the substrate is electrically coupled, wherein each of the plurality of flex electrical conductors is connected to a different output of the multi-layer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.