High power shunt switch with high isolation and ease of assembly
US7439610B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 2006 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Dec 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high power shunt switch comprises a leadframe including a paddle for supporting a shunt element, and a plurality of bond pads located around a periphery of the paddle, wherein at least a first subset of the bond pads are aligned in a substantially straight-line configuration. A shunt element is fixedly attached to the paddle and wire bonded to a top surface of one the bond pads. An encapsulant is disposed on the paddle, the shunt element, the plurality of bond pads, and the wire bond, thereby forming an encapsulated package structure. The package structure is positioned and attached to a transmission line such that the bottom surfaces of each of the at least first subset of bond pads are in simultaneous contact with the transmission line. The package structure and the transmission line are fixedly attached to a suitable substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.