Method of manufacturing ultrasound transducer device having acoustic backing
US7441321B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2004 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Aug 29, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4908
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.