Heatsink
US7441591B2 · kind B2 · utility
1Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2006 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Mar 2, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a heatsink, including a cooling zone to contact an object to be frozen and having microchannels formed therein to define a plurality of fluid pathways, an inlet through which a working fluid enters, a distributor, interposed between the inlet and the cooling zone, to uniformly distribute the working fluid introduced through the inlet to the microchannels, an outlet through which the working fluid, passing through the cooling zone, exits, and a collector, interposed between the cooling zone and the outlet, to collect the working fluid passing through the microchannels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.