Bond coat for silicon-containing substrate for EBC and processes for preparing same
US7442444B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2005 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Oct 28, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/264
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An article comprising a silicon-containing substrate, a silicide-containing bond coat layer overlying the substrate, and typically an environmental barrier coating overlaying the bond coat layer. An article is also provided wherein the environmental barrier coating comprises: (1) an optional inner silica scale layer overlaying the bond coat layer; (2) intermediate layer overlaying the inner silica scale layer, or the bond coat layer in the absence of the inner silica scale layer, and comprising mullite, or a combination of mullite with a barium strontium aluminosilicate, a yttrium silicate, or a calcium aluminosilicate; and (3) an outer steam-resistant barrier layer overlaying the intermediate layer and consisting essentially of an alkaline earth silicate/aluminosilicate. Processes are also provided for forming the silicide-containing bond coat layer over the substrate, followed by forming the environmental barrier coating over the bond coat layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.