Method for producing an optical or electronic module provided with a plastic package

US7442559B2 · kind B2 · utility

Assignee

• Avago Technologies Fiber IP (Singapore) Pte. Ltd. · SG

Inventors

• Albert Auburger · Regenstauf, DE
• Hans Hurt · Regensburg, DE
• Stefan Paulus · Zeitlarn, DE
• Nikolaus Schunk · Deggendorf, DE
• Frank Weberpals · Regenstauf, DE
• Josef Wittl · Parsberg, DE

Key dates

• Filing date: Jul 27, 2005
• Grant date: Oct 28, 2008
• Expiry date: Dec 23, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1815

Abstract

A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.