Cleaning composition and method of cleaning semiconductor substrate
US7442675B2 · kind B2 · utility
6Cited by
10References
6Claims
0Family size
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Key dates
| Filing date | Jun 10, 2004 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Jun 17, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total amount of the solution. This cleaning composition can singly and effectively remove a photoresist film, a buried material, a metallic residue from the surface of a semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.