Imaging module and method for forming the same
US7443028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2006 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Nov 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imaging module is formed by stacking: a first resin board; a second resin board having a first opening; a first electrically-conductive member electrically connecting the first resin board and the second resin board to each other; a printed circuit board having a second opening; a second electrically-conductive member electrically connecting the second resin board and the printed circuit board to each other; an imaging semiconductor chip mounted on the lower surface of the second resin board to cover the first opening and provided with an imaging sensor, an optical member placed on the upper surface of the second resin board to cover the first opening; a first semiconductor control chip provided with a control device for controlling operation of the imaging sensor and mounted on the lower surface of the first resin board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.