Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
US7443042B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2006 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Oct 21, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49194
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.