Flexible circuit board with heat sink
US7443678B2 · kind B2 · utility
24Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2006 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Nov 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon. The heat spreader has a first lower surface and a first upper surface which has a plurality of first grooves formed thereon. At least one platform is formed between two adjacent ones of the first grooves for mounting the at least one circuit substrate. The heat sink has a second lower surface and a second upper surface which has a plurality of second grooves formed thereon and is connected to the first lower surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.