Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly
US7443685B2 · kind B2 · utility
1Cited by
11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2005 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Nov 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermally conductive member mountable on an opposite face of a circuit board from a face of the circuit board on which an electrical component is mounted, the thermally conductive member operable to conduct heat generated by the electrical component away from the electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.