Modular diode laser assembly
US7443895B2 · kind B2 · utility
33Cited by
33References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2006 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Mar 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02407
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.